Application of Fluoroplastics in the Semiconductor Industry

Currently, the biggest challenge facing semiconductor manufacturing is pollution control, especially with the development of semiconductor technology, electronic components are becoming smaller and more complex, and their tolerance to impurities is also decreasing. Semiconductor production conditions are becoming more stringent, such as dust-free and clean, high temperature, and highly corrosive chemical transport. In the semiconductor field, the main functions of engineering plastics are packaging, transportation, and sealing, connecting every processing step to prevent pollution and damage, optimizing pollution control, and improving the yield of critical semiconductor processes.
Common types of polymer materials include PEEK, PPS, PP, ABS, PVC, PBT, PC, fluoroplastics, PAI, COP... The material requires dimensional stability, CLTE value, and chemical purity.

The application of common special engineering plastics in the semiconductor industry can be divided into the following sections:

fixtures and jigs: PEEK, PFA, PVDF, PTFE, POM, etc. are used to fix, support, and protect silicon wafers, wafers, and other devices.

Chemical treatment equipment: Corrosion resistant materials such as PFA and PTFE are used for pipelines, valves, and pump bodies, suitable for treating corrosive solutions.

Seals: High temperature resistant and chemically inert materials are used for O-rings and other seals to ensure stable operation of the equipment.

Electronic components: Materials with excellent insulation properties such as PFA and POM are used for insulation components and connectors.

Transmission components: High mechanical performance materials such as POM and PA66 are used for bearings and sliding parts to meet high-precision requirements.
Plastic products include CMP fixed rings, wafer carriers, photomask boxes, fixtures, vacuum suction pens, chemical/electronic gas transportation and storage, packaging test sockets, cleaning baskets, gas filter cartridges, bearing guides, release films, IC trays...

Common processing techniques include molding, injection molding, vacuum forming, blow molding, extrusion, etc.

PEEK、PPS、LCP、 Epoxy resin and other materials are suitable for injection molding process, requiring precise control of mold temperature and barrel temperature to avoid degradation; Sometimes post-treatment (annealing) is required to eliminate internal stress.

The vacuum forming process involves heating plastic sheets such as PP, PC, PVC, ABS, etc. and adsorbing them onto molds to form semiconductor equipment components such as retaining rings and CUPs. Its advantages include rapid prototyping, low cost, support for complex shape customization, high flexibility, suitable for small batch production and rapid prototyping.

In addition, with the rapid growth of the semiconductor industry, the demand for upstream raw materials such as organosilicon, epoxy resin, and fluorine materials has increased. Organic silicon, due to its unique structure, has advantages such as high and low temperature stability and insulation properties. It is used as an insulating material in the electronic field, sealing and protecting circuits and semiconductor components, adapting to the development of lightweight equipment, and applied to various types of electronic components; Epoxy resin, as a key bottom filling material for chip packaging, can protect chips and provide cushioning support. Its technology is constantly upgrading with the advancement of semiconductors; Fluorine materials are indispensable in semiconductor processes due to their stability and other characteristics. For example, electronic grade hydrofluoric acid is used for cleaning and etching in multiple fields, fluorine containing special gases assist in electronic manufacturing (playing multiple functions such as cleaning, etching, doping, and film formation), and PFA products are suitable for high-purity chemical processing (including storage, transportation, and processing) to ensure stable and safe manufacturing.